Microfafbricated Multi-analysis System for Electrophysiological Studies of Single Cells

iii ACKNOWLEDGEMENTS First and foremost, I need to thank my parents and my sister for always encouraging me throughout my long study. I would like to thank my advisor, Dr. Bruno Frazier, for providing me the opportunity to study under his guidance and encouraging me with patience throughout the years. I would also like to thank Dr. for valuable discussion and help regarding patch clamping and providing bovine chromaffin cells. Appreciation is also given to Dr. Lily Yang from the Emory University for providing the breast cancer cell lines. Appreciation is given to all the members of the University who always encouraged me and provided guidance and mentoring. Figure 3.1 Mask layer of the (a) overall electrode configuration and (b) enlarged Figure 3.2 Picture of the fabricated silicon part. Each quarter of the 3-inch diameter silicon wafer has 16 analysis sites. All the electrodes are routed to the bonding pads located at the edge of the wafer for easy Figure 3.3 Picture of the enlarged views of the fabricated silicon part. (a) An array of 8 analysis sites with two and four electrode configurations. (b) Enlarged view of an analysis site with 16 µm diameter cavity, 3 µm diameter via, and four opposing electrodes. (c) Enlarged view of an analysis site with 10 µm diameter cavity, 2 µm diameter via, and two opposing electrodes .. Figure 3.4 (a) Scanning electro micrograph of a 3.0 µm diameter via created in SiO 2. (b) Scanning electro micrograph of an analysis site. (c) 3-D optical profilometer scan of an analysis site .. Figure 3.7 Picture of the (a) fabricated three-inch diameter silicon microstencil and (b) silver electrodes stenciled on the backside of the silicon part of the fabricated analysis system .. Figure 3.8 Fabrication steps for the silicon part. (a) SiO 2 deposition on Si (b) SiO 2 patterning in ICP (c) Si etching using ICP Bosch process (d) Spincoating polyimide (e) Ti/Au deposition (f) Electrode patterning (g) Spincoating polyimide (h) Aluminum deposition (i) Aluminum patterning (j) Polyimide etching in RIE (k) aluminum removal (l) Patterning backside (m) Etching Si using ICP Bosch process (n) Figure 3.10 Design of the fluidic channel/interface part of (a) first generation that contains 4 fluidic chambers and (b) second generation that contains 8 Figure 3.11 Picture of the stereolithographically fabricated fluidic channel/interface part. (a) The first design has 4 pairs of inlet/outlet ports into which tubing can …